Basic Knowledge of Potting Adhesives

Epoxy resin can only deliver practical performance after curing via mixing with curing agents. One feature lies in diverse mixing processes. By selecting different curing agents, modifiers, tougheners, fillers or pigments, epoxy resin can obtain various customized special properties, greatly broadening its application scope. Many factors affect epoxy‑resin application. Key points include: formulation design (resin, curing agent, auxiliary materials selection, curing process etc.); proper mastering of construction technologies and attention to every operating link according to process‑equipment‑site conditions.

Epoxy resin application generally includes the following procedures:

1. Formulation selection. 2. Surface treatment. 3. Adhesive mixing. 4. Gluing or potting. 5. Gel fixation. 6. Curing. Formulation depends on application purpose; different application scenarios adopt different design schemes. Different formulation designs directly affect service effect (efficiency) of finished products. Surface treatment is critical; otherwise bonding strength will be impaired. When mixing adhesive, weigh resin, filler, diluent and other materials per formulation requirements, stir evenly, then fully blend with curing agent. Minimize air entrapment during gluing or potting. Some adhesives shall be vacuum‑defoamed before use; vacuum casting is recommended when conditions permit. Gel fixation is vital for bonding operations. Due to low initial viscosity of epoxy bonding system, bonded substrates shall be fixed. Pressure shall be applied for laminated products until gelation before pressure removal. Curing shall be performed strictly at specified temperature and time to achieve expected properties of cured products.

Post‑cured epoxy‑resin products feature numerous merits including outstanding mechanical performance, favorable electrical insulation, good corrosion resistance, moisture‑proof & flame‑retardant properties, low shrinkage, high bonding strength and convenient operation. Therefore, they are widely used in preparation of coatings, adhesives, laminates, casting compounds, encapsulating compounds and impregnating compounds, playing vital roles in machinery manufacturing, electrical & electronics, transportation, petrochemicals, national defense and other fields.