Products
Product Name:
Base Agent WEXP‑85 General‑Grade Epoxy Potting Compound
Curing Agent WEXP‑983 Curing Agent
Product Introduction:
WEXP‑85 epoxy potting compound is mainly composed of epoxy resin mixed with selected fillers, serving as special potting material for capacitors, transformers, inductors and filters.
Main Features:
1. Low viscosity for smooth casting.
2. Fast curing speed and smooth gate surface.
Product Indicators:
|
Component A |
Component B |
|
|
Appearance |
Black Viscous Liquid* |
Brown Liquid |
|
Viscosity (25℃) mpa.s |
4000~25000 |
50~200 |
|
Specific Gravity |
1.20~1.90 |
0.85~1.10 |
|
Gel Time (60℃) |
23′~30′ |
|
|
Note: Color can be formulated per customer requirements |
||
Application Process:
1. Weight ratio: A：B= 100：20~25
2. Operating process: Weigh accurately per mixing ratio, stir thoroughly, vacuum‑defoam, then perform encapsulation.
3. Curing condition: 25℃ ≥24h or 60℃ for 90min
Note: If sediment exists in Component A or B, stir each component thoroughly before use
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