TH One‑Component Adhesive for Copper Rods

Product Name:TH One‑Component Adhesive

Overview:

This one‑component adhesive is liquid at room temperature, volatile and requires refrigeration storage.

This product is mainly used for copper‑rod surface brushing to enhance bonding performance between copper rod and epoxy.

Features:

1. Easy‑to‑use one‑component system.

2. Low viscosity for convenient brushing.

3. Effectively improve bonding strength between copper rod and epoxy.

4. Improve air tightness and partial discharge after application in medium‑ and high‑voltage insulating parts.

Basic Properties:

Basic Operating Procedure:

1. Sand‑blasting pretreatment for copper rod sample surface.

2. Clean and dry copper rods, then brush on surface.

3. Pre‑cure at 120℃ for 1～2 hours for standby.

Note) Stir product sufficiently before weighing and use.