Products
Product Name
Base Agent APR2015 Epoxy Adhesive
Curing Agent APH2015 Curing Agent
Overview
This high‑temperature‑curing two‑component product is mainly used for metal‑to‑metal bonding, bonding between metals and other heat‑resistant materials, lamination bonding of silicon‑steel sheets and bonding of glass‑fiber materials.
Features
High‑temperature curing with relatively low shrinkage;
Low viscosity and low volatility;
Good weather resistance and chemical resistance;
Basic Properties
Project | Base Agent APR2015 | Curing Agent APH2015 | |
Appearance | Light‑Yellow Liquid | Light‑Yellow Liquid | |
Viscosity (25℃) | Mpa.s | 10000~20000 | 10~30 |
Specific Gravity | 1.14~1.16 | 0.90~1.05 |
Basic Process Requirements
1. Mixing ratio: Component A : Component B =100g：30g
2. Pre‑treat bonding interfaces before operation.
3. Weigh accurately per mixing ratio, stir thoroughly, then apply by brushing.
4. Curing condition: Pre‑drying at 100℃~150℃ + curing at 140℃~180℃
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